학술지명: Materials
발행국가: 스위스
발표일자: 2020년 7월
SCI여부 : SCIE
원문Link: https://www.mdpi.com/1996-1944/13/13/2977
제목: Deposition of Durable Micro Copper Patterns into Glass by Combining Laser-Induced Backside Wet Etching and Laser-Induced Chemical Liquid Phase Deposition Methods
저자: 서재민(서울대학교) 권귀감(서울대학교) 송기영(샤프정밀) 주종남(서울대학교) 안성훈(서울대학교)
내용: 레이저를 이용하여 투명한 유리에 전도성 구리 배선을 증착시킴.
초록Abstract: Glass is a well-known non-conductive material that has many useful properties, and considerable research has been conducted into making circuits on glass. Many deposition techniques have been studied, and laser-induced chemical liquid phase deposition (LCLD) is a well-known and cost-effective method for rapid prototyping of copper deposition on glass. However, the deposition results from the LCLD method on the surface of glass, which shows an issue in its detachment from the substrates because of the relatively low adhesion between deposited copper and the nontreated glass surface. This problem undermines the usability of deposited glass in industrial applications. In this study, the laser-induced backside wet etching (LIBWE) method was performed as a preceding process to fabricate microchannels, which were filled with copper by LCLD. Additional durable copper wire was produced as a result of the enhanced adhesion between the glass and the deposited copper. The adhesion was enhanced by a rough surface and metal layer, which are characteristics of LIBWE machining. Furthermore, the proposed method is expected to broaden the use of deposited glass in industrial applications, such as in stacked or covered multilayer structures with built-in copper wires, because the inserted copper can be physically protected by the microstructures.
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