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  [JMPT (스위스/SCIE)] Precise glass microstructuring with laser induced backside wet etching using error-compensating scan pat…
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  트랙백 주소 : http://sharp-eng.com/web/bbs/tb.php/group_02_b_03/199
   https://www.sciencedirect.com/science/article/pii/S0924013621000066 (13585)
학술지명: Journal of Materials Processing Technology
발행국가: 스위스
발표일자: 2021년 5월
SCI여부  :  SCIE
원문Link: https://www.sciencedirect.com/science/article/pii/S0924013621000066

제목: Precise glass microstructuring with laser induced backside wet etching using error-compensating scan path
저자: 권귀감(서울대학교) 송기영(샤프정밀) 서재민(서울대학교) 주종남(서울대학교) 안성훈(서울대학교)
내용: 레이저를 이용하여 유리에 미세한 형상을 가공함

초록Abstract: Laser induced backside wet etching (LIBWE), a simple-setup process capable of processing transparent materials, has been studied to overcome difficulties in glass micromachining. However, LIBWE still show practical difficulty in machining various glass applications due to the crack occurrence and unprecise final geometry. This study proposes the error-compensating scan path generation method for the precise fabrication of glass microstructures without additional devices. In conventional scan paths, the overlap of scan path’s initial and final points, constant scan path patterns and uneven distributions of laser irradiation were the leading causes of geometric errors. The scan path generation method was developed to minimize or eliminate the causes of geometric errors in conventional scan path methods. Machined results, with error-compensating scan path, showed the removal of significant error from conventional paths with proper material removal rates. The effects of scan path generation parameters on the machining characteristics were also investigated. By adjusting the scan duty ratio and laser irradiation distribution of the entire scan path, micropockets with an average surface roughness of 0.26 μm could be processed at a material removal rate of 29,700 μm3/s. Based on machining characteristics of the errorcompensating scan path, various glass microstructures were fabricated and the feasibility of the proposed method was verified.